OH12AF Hall Effect Element

Part No.: OH12AF

Operation Temperature: -40 to 120℃

Package: SOT143, 3000pcs/reel

Datasheet: OH12AF Insb Hall Element

Description

 

1.Maximum Ratings (Ta=25)

Parameter Symbol Rating Unit
Maximum Input Current Imax 20 (at 25℃) mA
Maximum Power Dissipation Pmax 150 (at 25℃) mW
Operating Temperature Range Top -40 ~ +120
Storage Temperature Range Tst -40 ~ +150

 

  1. Electrical Characteristics (Measured at 25)
Parameter Symbol Measurement Conditions Min Max Unit
Output Hall Voltage VH Vin=1V, B=500G 122 320 mV
Input Resistance Rin I=0.1mA 240 550 W
Output Resistance Rout I=0.1mA 240 550 W
Offset Voltage VO Vin=1V, B=0G -7 +7 mV
Temp. Coeff. of VH α Ta=0 ~ +40℃ AVG. -1.8 % /℃
Temp. Coeff. of

Rin, Rout

β Ta=0 ~ +40℃ AVG. -1.8 % /℃

※ VH=VHM-VO ( VHM : The output voltage measured at 500G.)

 

  1. Rank Classification and Mark on Output Hall Voltage
Output Hall Voltage,

VH  (mV)

Rank Mark Measurement

Conditions

228 ~ 274 E SSE Vin=1V, B=500G

(Constant Voltage)

266 ~ 320 F SSF

※ We hope to get the consultation with user for the request of F rank.

  1. Method for Mounting

 

4-1. Soldering Conditions on PCB

No Rapid Heating and Cooling.

Recommended Preheating condition is at 130~150℃ for 2~3minutes .

Recommended Reflowing condition is at 220~230℃ for 10~15seconds .

 

4-2. Soldering Method and Temperature

Items Methods Temperature
Reflow Soldering by Passing the Heated Zone Max 250℃

in 20sec

Solder Iron Soldering by Soldering Iron Max 300℃

in 3sec

 

OH12AF Insb Hall Element